ASUS PRO WS X299 SAGE II

Las placas base ASUS Pro Workstation están diseñadas para profesionales en entrenamiento de IA, aprendizaje profundo, animación, renderizado 3D o producción de medios. Con gráficos expandibles, almacenamiento extenso, conectividad impresionante y rendimiento y confiabilidad generales excepcionales, las placas base Pro Workstation son la solución ideal para profesionales creativos. Cada placa base incluye un software de administración centralizado con soporte para administración fuera de banda, por lo que también son una opción eficiente y rentable para los administradores de TI.

Placa base Intel CEB LGA 2066 para procesadores Intel Core X-series, con overclocking AI, doble Intel 2.5G Ethernet, 7 ranuras PCIe Gen 3, soporte de memoria DDR4 4266 MHz, doble M.2, triple U.2, USB 3.2 Gen 2 Type -C y Aura Sync RGB iluminación

• Zócalo Intel LGA 2066: listo para los últimos procesadores Intel® Core ™ serie X
• AI Overclocking: Optimiza rápidamente el rendimiento de la CPU al perfilar la CPU y el enfriador, logrando resultados que están extremadamente cerca del ajuste manual realizado por expertos.
• LAN dual Intel® 2.5G: ofrece un mayor rendimiento de datos y una eficiencia mejorada, lo que la hace ideal para transferencias de archivos grandes y respaldo
• Se adapta a tarjetas gráficas de hasta 4 vías: incluye 7 ranuras PCIe Gen 3 x16 y es compatible con NVIDIA® SLI y AMD CrossFire ™
• Disipador de calor VRM ultraeficiente: el diseño de matriz de aletas metálicas maximiza el área de superficie para la disipación del calor para permitir un rendimiento sin límites
• Conectividad de próxima generación: velocidades de transferencia de próxima generación con doble M.2, triple U.2 y USB 3.2 Gen 2 Type-A y Type-C ™

Especificaciones

• CPU
  Intel® Socket 2066 Core™ X-Series Processors
  Supports Intel® Virtual RAID on CPU (VROC)
  * The Intel® Turbo Boost Technology 3.0 Support Depends on the CPU types.
• Chipset
  Intel® X299
• Memory
  Intel® Core™ X-series Processors (6-core above)
  8 x DIMM, Max. 256GB, DDR4 4266(O.C.)/4200(O.C.)/4133(O.C.)/4000(O.C.)/3600(O.C.)/2933/2666/2400 MHz Non-ECC, Un-buffered Memory
  Supports Intel® Extreme Memory Profile (XMP)
  * Hyper DIMM support is subject to the physical characteristics of individual CPUs. 
  * Actual memory frequency differs from Intel CPU types and memory module. Please check Intel official site for more detail about the memory types supported by each CPU.
• Multi-GPU Support
  Supports NVIDIA® 4-Way SLI® Technology
  Supports AMD 4-Way CrossFireX Technology
• Expansion Slots
  7 x PCIe 3.0/2.0 x16 (single x16 or dual x16/x16 or triple x16/x16/x16 or quad x16/x16/x16/x16 or seven x16/x8/x8/x8/x8/x8/x8) *1
• Storage
  Intel® X299 Chipset :
  1 x M.2_1 socket 3, with M Key, type 2242/2260/2280/22110 storage devices support (both SATA & PCIE mode)*2
  1 x M.2_2 socket 3, with M Key, type 2242/2260/2280 storage devices support (PCIE mode only)
  8 x SATA 6Gb/s port(s)
  3 x U.2 connector*3
  Support Raid 0, 1, 5, 10
  Support Intel® Rapid Storage Technology enterprise 5.1 for X-Series(6-core and above) CPU RAID
  Supports Intel® Smart Response Technology
  Intel® Rapid Storage Technology 15 support
  Intel® Optane™ Memory Ready
  Intel® Virtual RAID (VROC) support for CPU RAID
• LAN
  Intel® I225-LM
• Audio
  Realtek® S1200A 7.1-Channel High Definition Audio CODEC
  – Impedance sense for front and rear headphone outputs
  – Internal audio Amplifier to enhance the highest quality sound for headphone and speakers
  – Supports : Jack-detection, Multi-recording, Front Panel MIC Jack-retasking
  – High quality 120 dB SNR stereo playback output (Line-out at rear) and 113 dB (Line-in)
  Audio Feature :
  – DTS Connect
  – DTS Headphone:X
  – DTS X®:Ultra
  – Audio amplifier: Provides the highest-quality sound for headphone and speakers
  – Premium Japanese-made audio capacitors: Provide warm, natural and immersive sound with exceptional clarity and fidelity
  – Unique de-pop circuit: Reduces start-up popping noise to audio outputs
  Separate layer for left and right track, ensuring both sound deliver equal quality
• USB Ports
  Intel® X299 Chipset :
  8 x USB 3.2 Gen 1 port(s) (6 at back panel, , 2 at mid-board)
  Intel® X299 Chipset :
  4 x USB 2.0 port(s) (4 at back panel, )
  ASMedia® USB 3.2 Gen 2 controller :
  2 x USB 3.2 Gen 2 port(s) (2 at back panel, , Type-A + USB Type-CTM)
  ASMedia® USB 3.2 Gen 2 controller :
  1 x USB 3.2 Gen 2 port(s) (1 at mid-board)
• Special Features
  OC Design – ASUS PRO Clock II Technology
  5-Way Optimization by Dual Intelligent Processors 5
  – 5-Way Optimization tuning key perfectly consolidates TPU, EPU, DIGI+ Power Control, Fan Xpert 3, and Turbo App
  TPU

  Fan Xpert4
  – Fan Xpert 4 featuring Fan Auto Tuning function and multiple thermistors selection for optimized system cooling control
  ASUS 5X Protection III :
  – ASUS SafeSlot Core: Fortified PCIe Slot prevents damage
  – ASUS Overvoltage Protection: World-class circuit-protecting power design
  – ASUS Stainless-Steel Back I/O: 3X corrosion-resistance for greater durability!
  – ASUS Enhanced DRAM Overcurrent Protection – Short circuit damage prevention
  – ASUS ESD Guards – Enhanced ESD protection
  ASUS EPU :
  – EPU
  ASUS Digital Power Design :
  – Industry leading Digital 8 Phase CPU Power Design
  – Industry leading Digital 2 Phase DRAM Power Design
  AURA :
  – Aura RGB Strip Headers
  – Aura Addressable Strip Header(s)
  ASUS Exclusive Features :
  – AI Suite 3
  – Ai Charger+
  – Crystal Sound 3
  ASUS EZ DIY :
  – ASUS CrashFree BIOS
  – ASUS EZ Flash
  – ASUS USB BIOS FlashBack™
  – Multi-language BIOS
  ASUS Q-Design :
  – ASUS Q-Shield
  – ASUS Q-Cable
  – ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED)
  – ASUS Q-Slot
  – ASUS Q-DIMM
  – ASUS Q-Connector
  M.2 and U.2 Onboard (The Latest Transfer Technology with up to 32Gb/s Data-transfer Speeds for M.2 and U.2)
  Thunderbolt 3 support

• Back I/O Ports
  2 x LAN (RJ45) port(s)
  1 x USB 3.2 Gen 2(teal blue)Type-A
  1 x USB 3.2 Gen 2 (black)USB Type-CTM,
  6 x USB 3.2 Gen 1 (blue)
  4 x USB 2.0 (one port can be switched to USB BIOS FlashBack™)
  1 x Optical S/PDIF out
  1 x USB BIOS FlashBack™ Button(s)
  1 x 8-channel Audio I/O
• Internal I/O Ports
  2 x CPU Fan connector(s)
  2 x Chassis Fan connector(s)
  2 x Addressable RGB header
  1 x AAFP connector
  2 x Aura RGB Strip Headers
  1 x M.2 Socket 3 with M key, type 2242/2260 storage devices support (both SATA & PCIE mode)
  1 x M.2 Socket 3 with M Key, type 2242/2260/2280 storage devices support (PCIE mode only)
  1 x TPM header
  8 x SATA 6Gb/s connector(s)
  1 x VROC_HW_Key
  1 x AIO_PUMP connector
  1 x Thunderbolt header(s)
  1 x 24-pin EATX Power connector(s)
  2 x 8-pin ATX 12V Power connector(s)
  1 x Power-on button(s)
  1 x Reset button(s)
  1 x Clear CMOS button(s)
  3 x U.2 connector
  1 x System panel connector
  1 x COM port header
  1 x W_Pump+ Header
  1 x Thermal sensor connector
  1 x CPU_OV jumper
  1 x M.2 Fan Header
  1x 6-pin ATX 12V Power connector
  1 x USB 3.2 Gen 2 (up to 10Gbps) connector
  1 x USB 3.2 Gen 1 (up to 5Gbps) connector support additional 2 USB ports
  3 x U.2 LED switch header
• Accessories
  User’s manual
  Addressable LED extension cable
  1 x Vertical M.2 bracket set
  I/O Shield
  1 x COM port cable(s)
  8 x SATA 6Gb/s cable(s)
  1 x M.2 screws
  1 x Supporting DVD
  1 x MOS Cooling kit (fan bracket and 40mm x 40mm fan)
  1 x 3-Way SLI bridge(s)
  1 x 4-Way SLI bridge(s)
  1 x SLI HB BRIDGE(2-WAY-M)
  1 x Q-connector(s) (0 in 1)
• Operating System
  Windows® 10 64-bitForm Factor
• CEB Form Factor
  12 inch x 10.5 inch ( 30.5 cm x 26.7 cm )
• Weight
  Color Box(3-in-1)
  Net Weight: 5.55kg
  Gross Weight: 8.06kg
  Bulk Pack(5-in-1)
  Net Weight: 6.99kg
  Gross Weight: 9.37kg
• Environment
  Operation temperature: 10℃ ~ 35℃
  Non operation temperature: -40℃ ~ 70℃
  Non operation humidity: 20% ~ 90% ( Non condensing)