Gigabyte B760m Gaming X Ax DDR4

El rendimiento sin restricciones de las placas base GIGABYTE está garantizado por un diseño térmico innovador y optimizado para garantizar la mejor estabilidad de la CPU, el chipset y la SSD y las bajas temperaturas bajo aplicaciones de carga completa y rendimiento de juegos.

• Intel® Socket LGA 1700: compatible con procesadores de la serie 13.ª y 12.ª generación
• Rendimiento incomparable: solución VRM digital híbrida de 8+1+1 fases
• Dual Channel DDR4: 4*DIMMs Compatibilidad con módulo de memoria XMP
• Almacenamiento de próxima generación: 2 conectores PCIe 4.0 x4 M.2
• Diseño térmico avanzado y protección térmica M.2: para garantizar la estabilidad de energía VRM y el rendimiento SSD M.2
• EZ-Latch: Ranura PCIe 4.0×16 con diseño de liberación rápida
• Redes rápidas: LAN de 2,5 GbE e Intel® Wi-Fi 6E 802.11ax
• Conectividad extendida: USB-C® frontal de 10 Gb/s, DP, HDMI
• Smart Fan 6: cuenta con múltiples sensores de temperatura, cabezales de ventilador híbridos con FAN STOP
• Q-Flash Plus: actualice el BIOS sin instalar la CPU, la memoria y la tarjeta gráfica

• Procesador
  • LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors
  • L3 cache varies with CPU
  • (Please refer “CPU Support List” for more information.)
• Chipset
  • Intel® B760 Express Chipset
• Memoria
  • Support for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules
  • 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
  • Dual channel memory architecture
  • Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
  • Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
  • Support for Extreme Memory Profile (XMP) memory modules
  • (Please refer “Memory Support List” for more information.)
• Gráfica Integrada
  • Integrated Graphics Processor-Intel® HD Graphics support:
  • 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
  • * Support for DisplayPort 1.2 version and HDCP 2.3
  • 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
  • * Support for HDMI 2.0 version and HDCP 2.3.
  • (Graphics specifications may vary depending on CPU support.)
• Audio
  • Realtek® Audio CODEC
  • High Definition Audio
  • 2/4/5.1/7.1-channel
  • * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
  • Support for S/PDIF Out
• LAN
  • Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
• Módulo de comunicaciones inalámbricas
  • AMD Wi-Fi 6E RZ608 (MT7921K)
  • WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands
  • BLUETOOTH 5.2
  • Support for 11ax 80MHz wireless standard and up to 1.2 Gbps data rate
  • (Actual data rate may vary depending on environment and equipment.)
• Zócalos de Expansión
  • CPU:
  • 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 (PCIEX16)
  • * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
  • Chipset:
  • 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x4 (PCIEX4)
  • Interfaz de almacenamiento
  • CPU:
  • 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)
  • Chipset:
  • 1 x M.2 connector (Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
  • 4 x SATA 6Gb/s connectors
  • RAID 0, RAID 1, RAID 5, and RAID 10 support for SATA storage devices
  • USB
  • Chipset:
  • 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header
  • 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header)
  • 1 x USB 2.0/1.1 port on the back panel
  • Chipset+2 USB 2.0 Hubs:
  • 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
• Conectores Internos E/S
  • 1 x 24-pin ATX main power connector
  • 1 x 8-pin ATX 12V power connector
  • 1 x CPU fan header
  • 3 x system fan headers
  • 2 x addressable LED strip headers
  • 2 x RGB LED strip headers
  • 2 x M.2 Socket 3 connectors
  • 4 x SATA 6Gb/s connectors
  • 1 x front panel header
  • 1 x front panel audio header
  • 1 x S/PDIF Out header
  • 1 x USB Type-C® header, with USB 3.2 Gen 2 support
  • 1 x USB 3.2 Gen 1 header
  • 2 x USB 2.0/1.1 headers
  • 2 x Thunderbolt™ add-in card connectors
  • 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
  • 1 x serial port header
  • 1 x reset button
  • 1 x Q-Flash Plus button
  • 1 x reset jumper
  • 1 x Clear CMOS jumper
• Panel E/S Trasero
  • 3 x USB 3.2 Gen 1 ports
  • 5 x USB 2.0/1.1 ports
  • 2 x SMA antenna connectors (2T2R)
  • 1 x HDMI 2.0 port
  • 1 x DisplayPort
  • 1 x RJ-45 port
  • 3 x audio jacks
• Controlador E/S
  • iTE® I/O Controller Chip
  • Monitorización Hardware
  • Voltage detection
  • Temperature detection
  • Fan speed detection
  • Water cooling flow rate detection
  • Fan fail warning
  • Fan speed control
  • * Whether the fan speed control function is supported will depend on the fan you install.
• BIOS
  • 1 x 256 Mbit flash
  • Use of licensed AMI UEFI BIOS
  • PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
• Otras Características
  • Support for GIGABYTE Control Center (GCC)
  • * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
  • Support for Q-Flash
  • Support for Q-Flash Plus
• Bundled Software
  • LAN bandwidth management software
• Sistema Operativo
  • Support for Windows 11 64-bit
  • Support for Windows 10 64-bit
• Formato
  • Micro ATX Form Factor; 24.4cm x 24.4cm