The Grizzly Thermal less Pad 8 is the ideal choice for applications where thermal grease is not an option due to the difficult to handle application, or where there is a gap between heat and heat source sinks, for example in chips of memory and voltage transformers.
It is based on a complex that contains carrier silicon and aluminum oxide as a heat transfer medium - as well as heat conductive pastes, and is therefore equally efficient.
The Minus 8 pad is available in three different sizes - here 120 x 20 mm - as well as in five thicknesses between 0.5 and 3 millimeters, so the pads work extraordinarily even at very low contact pressure and thermal conductivity is Only slightly influenced by the thickness. The choice of shoulderstand thickness so much, it just depends on the distance to save.
- Dimensions 120x20x3mm
- Quantity 1
- Thermal conductivity: 8 W / (m · K)
- Operating temperature: -100 to +200 ° C