Thermal paste for heat sinks. Maximizes the heat transmission between the chip and the metal of the heatsink . Essential for efficient cooling. Compatible with processors, chipsets, graphics cards, etc. Available in 0.5 or 1.5 g syringes.
Thermal conductivity:> 0.925 W / mK
Thermal impedance: <0.229 ºC / W
Dielectric constant:> 5.1
Operating temperature : -30 - 300 ºC