Thermal paste for heat sinks. Maximizes the heat transmission between the chip and the metal heat sink , essential for efficient cooling. Compatible with processors, chipsets, graphics cards, etc.
Quantity: 0.5 g
Thermal conductivity:> 1.8 W / mK
Thermal impedance: <0.123 ºC / W
Dielectric constant:> 5.1
Operating temperature : -30 - 300 ºC