High density thermal compound, ceramic base specially designed for modern processors and heatsinks of high power and performance in addition to water cooling solutions. Ceramics 2 uses only ceramic fillings, so it is not a conductor of electricity. It is a tri-linear compound of aluminum oxide, zinc oxide and boron nitride that allows the thinnest line of union between CPU and cooler. 2.7gr format.
* Easy to use.
* It is not electrically conductive.